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  篇名 作者 主题词 文摘
  二次检索范围  10 篇文章
     
     
 
Gold’s evolving role in the electronics industry

Publisher: Springer Berlin Heidelberg
Journal: Gold Bulletin
Volume: 47 Issue: 3 Page: 139-139
       
 
Evolution and investigation of copper and gold ball bonds in extended reliability stressing

Publisher: Springer Berlin Heidelberg
Journal: Gold Bulletin
Volume: 47 Issue: 3 Page: 141-151
       
 
Effect of gold addition on the microstructure, mechanical properties and corrosion behavior of Ti alloys

Publisher: Springer Berlin Heidelberg
Journal: Gold Bulletin
Volume: 47 Issue: 3 Page: 153-160
       
 
Generation of gold nanoparticles according to procedures described in the eighteenth century

Publisher: Springer Berlin Heidelberg
Journal: Gold Bulletin
Volume: 47 Issue: 3 Page: 161-165
       
 
Phase diagram of Au-Al-Cu at 500 °C

Publisher: Springer Berlin Heidelberg
Journal: Gold Bulletin
Volume: 47 Issue: 3 Page: 167-175
       
 
Probing the surface oxidation of chemically synthesised gold nanospheres and nanorods

Publisher: Springer Berlin Heidelberg
Journal: Gold Bulletin
Volume: 47 Issue: 3 Page: 177-183
       
 
Room temperature evolution of gold nanodots deposited on silicon

Publisher: Springer Berlin Heidelberg
Journal: Gold Bulletin
Volume: 47 Issue: 3 Page: 185-193
       
 
Lamellar-forming grain boundary reaction related to age-hardening mechanism in an Au-Pt-Pd-In metal-ceramic alloy

Publisher: Springer Berlin Heidelberg
Journal: Gold Bulletin
Volume: 47 Issue: 3 Page: 195-203
       
 
Gold etching for microfabrication

Publisher: Springer Berlin Heidelberg
Journal: Gold Bulletin
Volume: 47 Issue: 3 Page: 205-216
       
 
Highlights from recent literature

Publisher: Springer Berlin Heidelberg
Journal: Gold Bulletin
Volume: 47 Issue: 3 Page: 217-222